Semiconductor Packaging News5m
TSMC evolves CoWoS technology, to challenge 9x reticle sizes in 2027
TSMC evolves CoWoS technology, to challenge 9x reticle sizes in 2027: Summary TSMC revealed at the OIP Ecosystem Forum in Europe that its CoWoS packaging technology will achieve c ...
Semiconductor Packaging News21m
China’s AI balancing act — beating the U.S. but keeping the tech from threatening Beijing’s rule
China’s AI balancing act — beating the U.S. but keeping the tech from threatening Beijing’s rule: Summary Max Tegmark warns that China's race to create smarter-than-human AI ...
Semiconductor Packaging News24m
New US chip sanctions to hit Chinese tool makers, but Japan, Netherlands exempt
The U.S. will impose sweeping semiconductor export restrictions targeting 140 Chinese firms, including Naura Technology, Piotech, and Huawei-linked companies. The move aims to stymie China's ...
Semiconductor Packaging News21m
Intel CEO Gelsinger retires amid chipmaker’s turnaround plan
Summary Intel CEO Pat Gelsinger has retired amid the company’s turnaround efforts, leaving Intel CFO David Zinsner and Products CEO Michelle Holthaus as interim co-CEOs. Gelsinger’s exit follows ...
Semiconductor Packaging News22m
US adds curbs on chip tools to China
Summary The Biden administration tightened restrictions on China, targeting AI chip components and chipmaking equipment with new export controls. The US blacklisted 140 Chinese entities, citing ...
Semiconductor Packaging News21m
Chip Companies Play Bigger Role In Shaping University Curricula
Chip Companies Play Bigger Role In Shaping University Curricula: Summary The engineering talent shortage has pushed companies to hire and train fresh graduates, leveraging tailore ...
Semiconductor Packaging News21m
The Art of Failure Analysis 2024
Summary Engineers at the IPFA conference celebrate creativity in failure analysis with the Art of Failure Analysis contest. Submissions feature surprising microscopy images, like melted silicon ...
Semiconductor Packaging News52m
Samsung Electronics' half-century chip biz faces unprecedented challenges in AI era
Samsung Electronics' half-century chip biz faces unprecedented challenges in AI era: Summary Samsung Electronics faces intense pressure as the global memory market pivots to AI-fo ...
Semiconductor Packaging News17h
Intel CEO Pat Gelsinger is Out, Stock Up 5%
Intel CEO Pat Gelsinger retired effective Dec. 1, ending a turbulent tenure marked by ambitious initiatives and massive spending to revive the company. Interim co-CEOs and board member Frank Yeary now ...
Semiconductor Packaging News17h
The Forgotten Story of How IBM Invented the Automated Fab
Summary In 1970, Bill Harding led IBM's Project SWIFT to revolutionize semiconductor manufacturing. Automating processes ...
Semiconductor Packaging News23h
ASML and peers climb on hopes for less severe US curbs on China chips
ASML and peers climb on hopes for less severe US curbs on China chips: Summary Shares of ASML surged 4.3% on Thursday, with European chip equipment peers also climbing after Bloom ...
Semiconductor Packaging News23h
Lam Research to set up office at Tata-PSMC wafer fab
Summary Taiwan's PSMC is constructing a 12-inch wafer fab for Tata Electronics in India, while Lam Research seizes the opportunity by planning an office at the site, reflecting India's growing ...