A unique thermal-management device keeps optical components at a known, stable temperature and is key to their consistent ...

Teradyne has announced the UltraFLEXplus S series, beginning with the 24-slot UltraFLEXplus S24 system for engineering and ...

Stackpole Electronics has expanded its CSSU series of high-power metal-alloy current-sense resistors with 25 mΩ and 30 mΩ ...

Advantech’s AOM-2721 Open Standard Module (OSM) is now certified for Ubuntu 24.04 LTS. The module passed hardware ...

Navitas Semiconductor has introduced a 24 kW, 800 VDC-to-12 VDC power delivery board (PDB) for NVIDIA MGX AI data center ...

Nuvoton has introduced the NAU85L42YG, a quad audio ADC for wireless streaming and real-time voice capture applications. The ...

AI workloads, particularly large‑scale training and distributed inference, place unique demands on data center fabrics. While ...

AI may be able to speed up the design of a test system, but faster design also raises a bigger question: how do engineers ...

As AI moves further into engineering workflows, knowing what it can do is only part of the challenge. The bigger question is ...

Stackpole Electronics’ RMAN series thick-film chip resistors use an aluminum nitride (AlN) substrate to dissipate heat in high-power and continuously loaded industrial and automotive electronics. The ...

Emerson has added a four-port vector network analyzer (VNA) to its NI PXI platform and released synchronization-focused ...

Mini-Circuits has released a family of 4 × 4 and 8 × 8 Butler matrices for Wi-Fi and 5G FR1 antenna beamforming and MIMO test ...