The HFA80A automotive-grade analog-input class-D audio amplifier combines high efficiency, small size, and a low bill of materials, with load diagnostics optimized for automotive ... ST has introduced ...

Sondrel has announced that it has started front end, RTL design and verification work on a high-performance computing (HPC) chip project for a major new customer. Ollie Jones ... Semiconductor ...

The global wafer foundry market will grow 11.5% annually, reaching $270 billion by 2029, driven by AI and HPC demand. Foundries are advancing to 1.4nm processes and 2.5D/3D packaging while addressing ...

AspenCore China's China Fabless 100 ranks leading semiconductor firms, showcasing innovation in 10 technical segments. This year's report features public company rankings, market mapping, and key ...

TSMC's $65 billion investment in Arizona is set to boost the US's share of advanced semiconductor production to 21% by 2027, up from 9%, according to TrendForce. Taiwan remains dominant but sees its ...

Nordson ASYMTEK has developed new methods of selective conformal coating and process control that can be applied to protect the electronics in ...

Summary MediaTek ramps up its challenge to Qualcomm in India's premium 5G market by partnering with Chinese smartphone makers for high-end models. The company strategically targets growth, aiming to ...

The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance ...

Lawrence Livermore researchers developed a 3D-printable silicone foam with carbon nanotubes, delivering cushioning and ESD protection for electronics. This breakthrough could revolutionize robotics ...

Summary Dell Technologies reported mixed Q3 results, with earnings surpassing expectations but revenue missing forecasts. Despite strong AI-driven growth in server sales, shares dropped 10% after Q4 ...