Microchip Technology Inc. has expanded its data center portfolio with new connectivity, storage, and acceleration capabilities designed to meet the performance, security, and scalability needs of AI ...

At the OCP Global Summit, TI unveils three new chips for AI data centers—the 3-GSPS ADC, 800-V hot-swap controller, and BAW oscillator.

Artificial intelligence is reshaping data center architecture by changing where system bottlenecks occur. For years, networking discussions focused primarily on scale-out communication between servers ...

Synopsys and TSMC are expanding their collaboration to accelerate the development of AI, high-performance computing (HPC), and other advanced semiconductor systems. The latest work combines certified ...

Qt Group is a global software company, trusted by industry leaders and over 1.5 million developers worldwide to create applications and smart devices that users love. We help our customers increase ...

Cadence Design Systems Inc. has expanded its ChipStack AI Super Agent with a new RTL Generation Agent that automates front-end digital design tasks, from high-level specifications to RTL generation, ...

Targeting AI-first laptops, the CX C10 Max SoC also delivers a power-efficient architecture that enables thinner, lighter, and fanless devices with up to 19-hour battery life, according to the company ...

There are several ways to deploy a database on NAND flash memory: over a flash file system, over an FTL-provided block device, or with flash management integrated into the database storage layer. For ...