Qualcomm calls its sensing engine the Sensing Hub. Its 2024 whitepaper describes “an extremely efficient always-on AI ...

TSMC has announced plans to more than double its annual 2nm process production capacity by 2027 compared to this year. The company's 2nm revenue share reached 8% in Q3, up 5 percentage points from the ...

October 19, 2026 -- Tenstorrent, the AI computing company, has closed $1.5B in Series E funding at a $6.2B post-money valuation.

Intel CEO Lip-Bu Tan has defended the company's independence from the US government. Tan clarified that the US government's multibillion-dollar investment in the chipmaker does not give Washington ...

Embedded memory, not compute, has become the limiting factor in AI and HPC SoCs, consuming more than half of total die area while constraining bandwidth, latency, and energy efficiency. As the ...

October 16, 2026 – Weebit Nano Ltd ( ASX: WBT, Weebit or Company) provides this activity report for the quarter ended 30 September 2026 ( Q1 FY27 ), along with the Company’s Appendix 4C cash flow ...

GlobalFoundries has increased its capital investment in US semiconductor manufacturing facilities to $5 billion. This expansion is supported by an amended CHIPS Program award of up to $955 million.

Chiplets are reshaping CPU design, enabling data centers to do more without increasing space or power consumption. By Christopher Tozzi,Technology Analyst, datacenterknowledge.com ...

This year’s lecture connected the opportunities of AI with the need for more clear processes and routines, change fatigue, and the increasing demands that technological development places on boards ...

IBM and Siemens have announced a research collaboration to advance IBM’s 3D nanostack transistor architecture, targeting the design and manufacturing challenges of future angstrom-scale semiconductors ...

This year, for the semiconductor industry, Agent, Physical AI, and Edge AI are undoubtedly the hottest buzzwords. Chip manufacturers are ramping up investments in these tracks, even going all-in on ...

Samsung is reportedly considering an acquisition in the silicon photonics space as it looks to close the gap with TSMC in advanced chip packaging. The technology could help Samsung meet growing demand ...