Neuro-synaptic RAM; 3D photonic-electronic data link; complex memory management.

More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.

A new technical paper titled “Thermal Boundary Resistance Reduction by Interfacial Nanopatterning for GaN-on-Diamond ...

A new technical paper titled “Analyzing Modern NVIDIA GPU cores” was published by Universitat Politècnica de Catalunya.

A new technical paper titled “Synaptic and neural behaviours in a standard silicon transistor” was published by researchers ...

Unveiling GPU Bottlenecks in Large-Batch LLM Inference” was published by researchers at Barcelona Supercomputing Center, ...

U.S. IC chemicals and materials; China export blacklist expands; global fab equipment report; high-density 3D DRAM; ...

L-R: Cadence’s Young; Synopsys’ Stahl; Siemens’ Munsey; ChipAgents’ Wang; Theodore Wilson. SE: What is a digital twin in the ...

Semiconductor verification is changing to integrate AI with human expertise.

The chip industry is exploring multiple avenues for simplifying multi-die integration, but difficulties remain for optimizing ...

Verifying the functionality of a full multi-chip system, including digital controllers, analog electrical, and photonic ...

The founders of EDA are retiring, and perhaps it’s time that EDA headed off in a different direction.