On the sidelines of the COP17 Biodiversity Summit in Yerevan, President Kassym-Jomart Tokayev held meetings with UNESCO ...
HANMI Semiconductor is expanding its business of supplying 2.5D packaging equipment for mass production to global foundries ...
Two-dimensional (2D) semiconductors, only a few atomic layers thick, are promising materials for making AI chips faster and ...
On 16 March 2026, Jensen Huang opened Nvidia's GTC conference in San Jose and gave the first detailed look at Feynman, the chip generation Nvidia plans to ship in 2028. Nvidia first named Feynman at ...
Fourth-year student Berik Kanatbek, who studies at the Luban Workshop in Astana, has developed a device designed to ...
How complementary inspection and metrology techniques can detect smaller defects and distinguish among a wide range of defect types within a unified workflow.
Artificial intelligence, high-performance computing systems, advanced smartphones, automotive electronics, and ...
Researchers at Washington University in St. Louis are developing a new approach to build hetero-integrated photonic chips ...
A study from the Research Center for Materials Nanoarchitectonics (MANA), one of the centers under the National Institute for ...
That has made chiplets, HBM, silicon interposers, redistribution layers, bridges and 3D stacking increasingly important.
Masatoshi Takeichi is a cell biologist who discovered cadherins, cell adhesion molecules that bind animal cells together, and ...
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