The Sika AG-Bond has a maturity date of 8/27/2027 and offers a coupon of 0.4500%. The payment of the coupon will take place 1,0 times per Year on the 27.08.. At the current price of 100.15 CHF this ...

Abstract: Adhesive wafer bonding has emerged as a crucial technique in the fabrication and integration of a various range of devices, including MEMS, microfluidics, CMOS imaging sensors, RF and ...

Create a super strong bond using just glue, baking soda, and styrofoam in this clever DIY repair trick. Watch how this combo ...

Abstract: Scaling of die-to-wafer hybrid bonding to realize finer interconnects and greater disaggregation requires new solutions for fast bonding with precise ...