In today’s advanced packages, however, resistance no longer resides primarily inside transistors or neatly bounded test ...
The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...
Bonds and interconnects are especially problematic and require more test insertions. Ensuring reliability requires connecting fragmented data that is often siloed. The shift to multi-die assemblies is ...
Researchers from Rice University, University of Utah and National University of Singapore (NUS) published “Three-dimensional ...
Researchers from Fudan University designed a fiber integrated circuit (FIC) with a multilayered spiral architecture. The ...
Data center AI is driving a dramatic ramp in the growth of silicon photonics foundries: 8X growth in just 6 years, from 2026 to 2032. Scale-out is the major driver now. Scale-up will become the ...
Workflows and the addition of new capabilities are happening much faster than with previous technologies, and new grads may ...
D-IC thermal management & KGD strategies; system-level engineering; within-wafer variability; image segmentation.
Foundry-Enabled Patterning of Diamond Quantum Microchiplets for Scalable Quantum Photonics” was published by researchers at ...
The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.
Verifying an extensible processor is more than a one-step process, especially when software compatibility is important.
A practical, research-supported roadmap, outlining a six-phase path to certification.
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