A surge in demand for IC packages is causing long lead times for wire bonders, which are used to assemble three-fourths of the world’s packages. The wire bonder market doubled last year, alongside ...

The 3470-II automatic wire bonder is designed for first-level, gold or aluminum wire interconnect assemblies used in military and aerospace applications. The machine enables deep access wedge bonds ...

Kulicke & Soffa Industries Inc. today said Amkor Technology has indicated it will buy 200 of its Maxum ball bonders for ramping to ultra fine pitch wire bond technology. K&S said it expects to begin ...