It's a sign of the times when top semiconductor makers pool their resources to cover the rising cost of process technology development and fab construction. Providing the strongest evidence of this to ...
Power, performance, and area metrics alone are no longer sufficient to capture the full range of design goals.
Global Wafer Fabrication Market Research Report: By Equipment Type (Oxidation Systems, Diffusion Systems, Epitaxial Reactors, Photolithography Equipment, Ion Implantation Equipment and others), By ...
Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
MagnaChip Semiconductor, a worldwide semiconductor foundry, and Advanced Analogic Technologies, a developer of power management semiconductors, have announced the installation of AnalogicTech's ...
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Direct approach can bond and debond 2D semiconductors without any glue-like materials
A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, ...
BEDFORD, Mass. & SEOUL, South Korea--(BUSINESS WIRE)--Silicon wafer manufacturer 1366 Technologies together with its strategic partners, Hanwha Q CELLS Malaysia Sdn. Bhd. and parent company Hanwha Q ...
Electronic devices have become an indispensable part of our lives in our technology-driven world. These devices owe their existence to a crucial component known as the semiconductor wafer. In this ...
Nowhere is this transformation more visible than at Nvidia, whose valuation recently soared to about $5 trillion, making it ...
Phemet® captures more than 16 million data points in one second with ultra-high resolution for highly accurate surface measurements of memory and logic devices and advanced packagesMUNICH, Nov. 18, ...
LONDON — Intel Corp. is finishing the decommissioning of its Fab 14 in Leixlip near Dublin, Ireland. This reduces the number of wafer fabs Intel operates in Ireland to three; numbered 10, 24 and 24-2.
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