TEMPE, AZ--(Marketwire - Oct 22, 2012) - EPEPS -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced enhancements to its Allegro ® 16.6 ...

SAN JOSE, Calif. — IC package design has become a huge bottleneck for getting chips out the door, but there are few automated tools that can help, according to panelists at the International Symposium ...

In his San Francisco studio, package designer Primo Angeli explains that "there is a relationship between consumers and packages, a psychodrama, really." Indeed, packages are "silent salesmen" that ...

The vise is closing down on design departments.Manufacturers want more capabilitiesin their products than ever before. It’simperative for manufacturers to remaincompetitive. Marketing, meanwhile,wants ...

Cadence Design Systems (News - Alert), Inc. has unveiled an enhanced version of its Allegro 16.6 Package Designer and System-in-Package offering. Discreet IC package necessities for next-generation ...

Andrew Gibbs is the founder of The Dieline, the web’s best package-design blog, and he’s been trawling for cool packaging designs for years. Now, he’s gathered his favorite designs into book, Box ...

Originally, I started to write this entry about a Sustainable Brand Identity. But as I put pen to paper and fingers to keyboard, I realized that my opening paragraph deserved a bit more attention.

Members can download this article in PDF format. Today, advances in semiconductors and ICs are producing ever smaller and denser circuits. With that comes the challenge of efficiently packaging and ...