Applied Materials (NasdaqGS:AMAT) is acquiring ASMPT's NEXX business, adding advanced panel level packaging tools to its ...

South Korean semiconductor equipment maker Hanwha Semitech is reportedly preparing to supply fan-out panel-level packaging ...

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million it was granted from the US CHIPS Act. Now, Fab 9 and its neighbor, Fab 11X ...

TSMC introduces A13 and N2U chip technologies, leveraging existing ASML EUV machines TSMC plans advanced chip-packaging for AI, enabling larger, more complex chips Experts note advanced packaging ...

With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting toward advanced ...

TSMC is exploring a 'radically new' method of semiconductor chip packaging, as the world of AI is simply not slowing down and needs further advancements at every level to keep up. TSMC Is reportedly ...

The company held its Samsung Foundry Forum 2024 in San Jose, California, and teased its new 3D packaging technology for HBM chips in a public event, with current-gen HBM memory chips packaged mostly ...

NYSE Composite highlights Taiwan Semiconductor Manufacturing Company through semiconductor sector expansion, artificial ...