The performance of today’ electronic products relies heavily on the integrity of the tiny connections between microchips and circuits, which can number as many as 2,200. These bonds are tested ...
In my previous column (see “Editor's Picks,” at right), I discussed transverse flexural testing of a unidirectional composite as one method of evaluating the strength of the fiber/matrix interfacial ...
Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback