A new generation of AI-ready cooling and intelligent power management solutions designed to support high-density workloads ...

Securing supply chains in today’s global economy is more critical than ever. As supply chains become more complex and data flows increase, the risk profile expands significantly. One common approach ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

In the age of digital transformation, machine learning (ML) is rapidly becoming a pivotal technology in various sectors. One of ...

DALLAS--(BUSINESS WIRE)--Uptiq.AI, a leader in AI-powered solutions for the financial services industry, proudly announces its acquisition of UpSwot, a cutting-edge provider of financial data ...

As device scaling slows down, a key system functional integration technology is emerging: heterogeneous integration (HI). It leverages advanced packaging technology to achieve higher functional ...

Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing ...

TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the world's first “8-in-1” proof of concept* (PoC) for ...

SEMICON Taiwan 2024 is set to take place from September 4-6 at the Taipei Nangang Exhibition Center, spotlighting key industry themes such as the AI value chain, advanced processes, heterogeneous ...

Artificial Intelligence (AI) is driving demand for servers, high-end chips, and advanced packaging, with 3D chips as a potential star in next-generation advanced packaging technology. In this regard, ...

The goal of the program is to develop new frameworks and regulations for enabling safe operations of eVTOL and AAM aircraft.

Figure 1 LIS Technologies Inc. Appoints Former Air Force DeputyChief of Staff for Strategy, Integration, and Requirements, ...