Modern semiconductor processes are extremely complicated and involve thousands of interacting individual process steps. During the development of these process steps, roadblocks and barriers are often ...

That Nimbus 100TB 3.5” TLC SSD was $40,000 or $400/TB in 2018. They now have a 50TB model for $12,500 or $250/TB. They just released a 64 TB QLC version at $11,000 or $171/TB. If they use this new ...

3D NAND suppliers are accelerating their efforts to move to the next technology nodes in a race against growing competition, but all of these vendors are facing an assortment of new business, ...

To store ever more data in electronic devices of the same size, the manufacturing processes for these devices need to be studied in greater detail. By investigating new approaches to making digital ...

Fabrication of 3D NAND devices involves a challenging and complex deposition and etch process. Two etch processes have been identified as substantially impacting 3D NAND product yields: silicon ...

Freezing edge technology: A new plasma-based etching process could lead to denser data storage in phones, cameras, and computers. Researchers have developed a hydrogen fluoride plasma technique that ...

There is a growing demand for higher-density NAND flash across the global storage market. For the time being, this demand has been satisfied through many developments, not only in the capabilities of ...

In 2014, 3D NAND flash was introduced to the industry with 24 layers, and it co-existed with 2D NAND flash until 2017. 3D NAND flash gradually came to dominate the market with its high-density storage ...

Use left and right arrow keys to seek audio. NEO Semiconductor has announced that it has developed the "world's first 3D NAND-like DRAM cell array," which aims to increase DRAM chip density using ...